The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

May. 02, 2016
Applicant:

Juniper Networks, Inc., Sunnyvale, CA (US);

Inventors:

Susheela Nanjunda Rao Narasimhan, Fremont, CA (US);

Basavaraja Munishamappa, Bangalore, IN;

Troy M. Sheets, San Francisco, CA (US);

Luis Zamora, San Jose, CA (US);

Seongchul C. Kim, Saratoga, CA (US);

Assignee:

Juniper Networks, Inc, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01); H01L 23/367 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); H01L 23/3672 (2013.01); H01L 23/4006 (2013.01); H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 7/20127 (2013.01); H05K 7/20436 (2013.01); H05K 7/20518 (2013.01);
Abstract

The disclosed apparatus may include (1) a ganged heatsink base that (A) absorbs heat dissipated by a plurality of electronic components that consume differing amounts of power and (B) includes a plurality of thermal regions dedicated to absorbing the heat dissipated by the plurality of electronic components and (2) at least one thermal isolation engine that (A) is incorporated into the ganged heatsink base, (B) separates the plurality of thermal regions from one another, and (C) localizes the heat dissipated by the plurality of electronic components by maintaining at least some of the heat dissipated by one of the electronic components within the thermal region that absorbed the at least some of the heat such that the at least some of the heat does not migrate to another thermal region included in the ganged heatsink base. Various other apparatuses, systems, and methods are also disclosed.


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