The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Nov. 15, 2017
Applicant:
Fujifilm Electronic Materials U.s.a., Inc., N. Kingstown, RI (US);
Inventors:
Assignee:
Fujifilm Electronic Materials U.S.A., Inc., N. Kingstown, RI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/42 (2006.01); C08G 73/10 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); G03F 7/037 (2006.01); G03F 7/11 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
G03F 7/425 (2013.01); C08G 73/1067 (2013.01); G03F 7/037 (2013.01); G03F 7/11 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2006 (2013.01); G03F 7/325 (2013.01); G03F 7/40 (2013.01); G03F 7/405 (2013.01); G03F 7/427 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 21/31133 (2013.01);
Abstract
This disclosure relates to a process for stripping an organic film on a patterned semiconductor substrate. The process includes treating the organic film with an aqueous stripper composition to remove the organic film in one step. The organic film includes at least a first layer and a second layer, the first layer has a dissolution rate of at most about 0.01μ/min in a developer at 25° C., and the second layer has a dissolution rate of greater than about 0.01μ/min in the developer at 25° C.