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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10345515 B1

PDFFull Text
Date of Patent:
Jul. 09, 2019

Filed:

Jan. 06, 2016

Bonded structure, method for manufacturing the same, and bonding state detection method

Applicants:

Mitsubishi Heavy Industries, Ltd., Tokyo, JP;

The University of Tokyo, Tokyo, JP;

Inventors:

Nozomi Saito, Tokyo, JP;

Takayuki Shimizu, Tokyo, JP;

Toshio Abe, Tokyo, JP;

Shu Minakuchi, Tokyo, JP;

Nobuo Takeda, Tokyo, JP;

Yutaka Terada, Tokyo, JP;

Assignees:

MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;

THE UNIVERSITY OF TOKYO, Tokyo, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Michael P Mooney

Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 3/28 (2006.01); B32B 3/26 (2006.01); B32B 3/08 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); C09J 5/00 (2006.01); G01L 1/24 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01); G01M 11/08 (2006.01); G01N 19/04 (2006.01); G01N 33/44 (2006.01); G02B 6/02 (2006.01); G02B 6/34 (2006.01);
U.S. Cl.
CPC ...
G02B 6/022 (2013.01); B32B 3/085 (2013.01); B32B 3/263 (2013.01); B32B 3/28 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 9/045 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); C09J 5/00 (2013.01); G01L 1/24 (2013.01); G01L 1/242 (2013.01); G01L 1/245 (2013.01); G01M 11/086 (2013.01); G01N 19/04 (2013.01); G01N 33/44 (2013.01); G02B 6/02076 (2013.01); G02B 6/34 (2013.01); B32B 2250/40 (2013.01); B32B 2307/546 (2013.01); B32B 2605/18 (2013.01);
Abstract

The purpose of the present invention is to provide a bonded structure, a method for manufacturing the same, and a bonding state detection method which are capable of determining whether or not members are bonded together appropriately. A bonded structureincludes a laminated sheetA, a laminated sheetB, an adhesivethat bonds the laminated sheetA and the laminated sheetB together, and a distributed optical fibersandwiched between the laminated sheetA and the laminated sheetB. The cross-sectional shape of the distributed optical fiberis deformed in accordance with the bonding state.

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