The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Jun. 29, 2017
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Shinobu Tashiro, Hitachinaka, JP;

Keiji Hanzawa, Hitachinaka, JP;

Noboru Tokuyasu, Hitachinaka, JP;

Takeshi Morino, Hitachinaka, JP;

Ryosuke Doi, Hitachinaka, JP;

Akira Uenodan, Hitahinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01F 5/00 (2006.01); G01F 1/684 (2006.01); G01F 1/696 (2006.01); G01F 1/698 (2006.01); G01F 1/699 (2006.01); G01F 15/00 (2006.01); G01F 15/02 (2006.01); G01F 15/04 (2006.01); F02D 41/18 (2006.01);
U.S. Cl.
CPC ...
G01F 1/6842 (2013.01); F02D 41/187 (2013.01); G01F 1/6845 (2013.01); G01F 1/696 (2013.01); G01F 1/698 (2013.01); G01F 1/699 (2013.01); G01F 1/6965 (2013.01); G01F 5/00 (2013.01); G01F 15/006 (2013.01); G01F 15/02 (2013.01); G01F 15/04 (2013.01); G01F 15/043 (2013.01);
Abstract

Provided is a thermal flow meter to improve the measurement accuracy of a temperature detector. The thermal flow meter includes a bypass passage through which a measurement target gas flowing through a main passage flows, and a circuit package which includes a measurement circuit for measuring a flow rate of the measurement target gas flowing through the bypass passage and a temperature detecting portion for detecting a temperature of the measurement target gas. The circuit package includes a circuit package body which is molded by a resin to internally envelope the measurement circuit and a protrusion molded by the resin. The temperature detecting portion is provided in the leading end portion of the protrusion, and at least the leading end portion of the protrusion protrudes to the outside from a housing.


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