The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
May. 27, 2016
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 41/19 (2018.01); F21S 43/00 (2018.01); F21S 43/14 (2018.01); F21S 45/47 (2018.01); H05B 33/08 (2006.01); F21S 43/19 (2018.01); F21S 43/15 (2018.01); F21V 29/89 (2015.01); F21S 41/141 (2018.01); F21S 41/20 (2018.01); F21S 43/20 (2018.01); H05K 1/18 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21S 41/192 (2018.01); F21S 41/141 (2018.01); F21S 41/285 (2018.01); F21S 43/00 (2018.01); F21S 43/14 (2018.01); F21S 43/15 (2018.01); F21S 43/19 (2018.01); F21S 43/195 (2018.01); F21S 43/26 (2018.01); F21S 45/47 (2018.01); F21V 29/89 (2015.01); H05B 33/0803 (2013.01); H05B 33/0842 (2013.01); F21Y 2115/10 (2016.08); H05B 33/089 (2013.01); H05B 33/0812 (2013.01); H05B 33/0815 (2013.01); H05K 1/189 (2013.01);
Abstract
According to an embodiment, a light emitting device package includes: a thermally-conductive substrate having at least two mounting regions on which chips are mounted and at least one bending region; a light emitting device module including a light emitting device arranged on one surface of the mounting region; and a driving device module including a driving unit arranged on the other surface opposite to the one surface of the mounting region.