The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Oct. 24, 2013
Applicant:

Institute of Metal Research Chinese Academy of Sciences, Liaoning, CN;

Inventors:

Zhiquan Liu, Liaoning, CN;

Di Wu, Liaoning, CN;

Liyin Gao, Liaoning, CN;

Jingdong Guo, Liaoning, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/56 (2006.01); B32B 15/01 (2006.01); C25D 5/34 (2006.01); C25D 21/12 (2006.01); C25D 21/14 (2006.01);
U.S. Cl.
CPC ...
C25D 3/562 (2013.01); B32B 15/015 (2013.01); C25D 3/56 (2013.01); C25D 5/34 (2013.01); C25D 21/12 (2013.01); C25D 21/14 (2013.01);
Abstract

An Fe—Ni—P-RE multicomponent alloy plating layer, electrodeposition preparation method, and plating application. The alloy plating layer obtained via electrodeposition contains elements Fe, Ni, P and RE, with the following mass percentages Fe— 16%-65%, Ni— 25%-70%, combined Fe and Ni— 63%-91%, RE 1.6%-25%, and the balance being P. The plating solution mainly contains the following components: ferrous salt, nickel salt, NaHPO, RECl, HBOand NaCHO. A multicomponent alloy plating layer of different components can be obtained by adjusting the main salt and complexing agent in the plating solution and by adjusting the process Enabled is controllable adjustment to the components of the obtained plating layer while saving costs, improved characteristics such as the thermal expansion coefficient, electrical property, magnetic property, etc., and products and methods very suitable for applications in the field of micro-electronics.


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