The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Aug. 07, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Jae Hyun Kim, Daejeon, KR;

Shin Hee Jun, Daejeon, KR;

Jae Jin Kim, Daejeon, KR;

Chee-Sung Park, Daejeon, KR;

Eun Kyu Seong, Daejeon, KR;

Su Jeong Lee, Daejeon, KR;

Cheol-Hee Park, Daejeon, KR;

Han Nah Jeong, Daejeon, KR;

Sang Yun Jung, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/22 (2006.01); C23C 18/30 (2006.01); C23C 18/31 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 18/38 (2006.01); C09D 5/24 (2006.01); C25D 5/02 (2006.01); C25D 5/56 (2006.01); C23C 18/20 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
C23C 18/31 (2013.01); C09D 5/24 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1641 (2013.01); C23C 18/1689 (2013.01); C23C 18/204 (2013.01); C23C 18/2053 (2013.01); C23C 18/22 (2013.01); C23C 18/30 (2013.01); C23C 18/32 (2013.01); C23C 18/38 (2013.01); C25D 5/02 (2013.01); C25D 5/56 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 3/02 (2013.01); H05K 3/181 (2013.01); H05K 2201/09009 (2013.01);
Abstract

Provided are a method for forming conductive pattern by direct radiation of an electromagnetic wave capable of forming fine conductive patterns on various kinds of polymer resin products or resin layers by a simplified process, and appropriately implementing the polymer resin products having white color or various colors, and the like, even without containing specific inorganic additives in the polymer resin itself, and a resin structure having the conductive pattern formed therefrom. The method for forming the conductive pattern by direct radiation of the electromagnetic wave includes: forming a first region having a predetermined surface roughness by selectively radiating the electromagnetic wave on a polymer resin substrate containing titanium dioxide (TiO); forming a conductive seed on the polymer resin substrate; forming a metal layer by plating the polymer resin substrate having the conductive seed formed thereon; and removing the conductive seed and the metal layer from a second region of the polymer resin substrate, wherein the second region has surface roughness smaller than that of the first region.


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