The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
May. 22, 2015
Denso Corporation, Kariya, Aichi-pref., JP;
Adeka Corporation, Arakawa-ku, Tokyo, JP;
Kenji Koga, Kariya, JP;
Daisuke Takama, Kariya, JP;
Ryo Ogawa, Kounosu, JP;
Shinsuke Yamada, Nagareyama, JP;
Takuya Matsuda, Arakawa, JP;
DENSO CORPORATION, Kariya, Aichi-pref., JP;
ADEKA CORPORATION, Arakawa-ku, Tokyo, JP;
Abstract
Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.