The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Sep. 28, 2015
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Yoshihiko Tasaka, Tokyo, JP;

Zachary J. Thompson, Woodbury, MN (US);

Jun Fujita, Tokyo, JP;

Takahiro Kasahara, Tokyo, JP;

Sotaro Endo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 220/34 (2006.01); C08F 20/54 (2006.01); C09D 4/00 (2006.01); C09D 133/08 (2006.01); B05D 1/28 (2006.01); B05D 7/00 (2006.01); G02B 5/30 (2006.01);
U.S. Cl.
CPC ...
C09D 4/00 (2013.01); B05D 1/28 (2013.01); B05D 7/544 (2013.01); C08F 220/34 (2013.01); C09D 133/08 (2013.01); G02B 5/30 (2013.01);
Abstract

A method of curing a curable composition includes contacting the free-radically curable composition with the solid primer layer thereby causing at least partial curing of the curable composition. The solid primer layer includes a binder material, optional beta-dicarbonyl compound, and an organic peroxide. The curable composition includes at least one free-radically polymerizable compound, a polyvalent metal compound, and a quaternary ammonium halide. The method can be used for adhesive bonding of substrates and preparation of various articles.


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