The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Mar. 22, 2016
Daiwa Kasei Industry Co., Ltd., Aichi, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;
Kouji Kamiya, Aichi, JP;
Yuusuke Ito, Aichi, JP;
Makoto Suzuki, Aichi, JP;
Hiroaki Suzuki, Aichi, JP;
Kentaro Furuki, Aichi-ken, JP;
Masanari Ichihara, Aichi-ken, JP;
DAIWA KASEI INDUSTRY CO., LTD., Aichi-Ken, JP;
Abstract
An objective is to provide a hitherto not-existing retention component that is for a wiring bundle and can be manufactured without tying the wiring bundle, a wire harness including the retention component, and a manufacturing method and a manufacturing device for the wire harness. A metal mold that is used has a penetration hole in which a wiring bundle is to be penetratingly disposed, an annular retention portion-molding space for surrounding the outer circumference of the wiring bundle, and an engagement portion-molding space communicatively connected with the retention portion-molding space. The wiring bundle is disposed in the penetration hole, a melt resin is poured in the retention portion-molding space from the engagement portion-molding space, and solidified through cooling to mold a retention portion integrally with a engagement portion in a state of being closely adhered to an outer circumference of the wiring bundle.