The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Nov. 20, 2017
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Atsushi Teranishi, Kawasaki, JP;

Masaya Uyama, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B81B 1/00 (2006.01); B81C 1/00 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/16 (2013.01); B41J 2/14145 (2013.01); B41J 2/1603 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1642 (2013.01); B41J 2/1645 (2013.01); B41J 2/1646 (2013.01); B81B 1/004 (2013.01); B81C 1/00087 (2013.01); B41J 2002/14467 (2013.01); B81B 2201/052 (2013.01); B81B 2203/0353 (2013.01); B81C 2201/019 (2013.01); B81C 2203/032 (2013.01);
Abstract

A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.


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