The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
Apr. 13, 2015
Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;
Masakatsu Ohno, Utsunomiya, JP;
Kayo Kumakura, Tochigi, JP;
Satoru Idojiri, Tochigi, JP;
Yoshiharu Hirakata, Tochigi, JP;
Kohei Yokoyama, Fujisawa, JP;
Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;
Abstract
An object is to eliminate a harmful effect when a film is bonded by wiping an adhering sealant (). Characterized is a wiping device () including a stage () that supports a sheet-like member (), a wiping means () that wipes an adhering object () adhering on a peripheral portion of the sheet-like member (), a wiping cloth () that is attachably and detachably provided for the wiping means (), and a solvent () that adheres to the wiping cloth (), in which the wiping means () is provided with the wiping cloth (), makes the solvent () adhere to the wiping cloth (), and wipes the adhering object (), or a stack manufacturing apparatus () including such a wiping device ().