The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 09, 2019

Filed:

Jul. 16, 2018
Applicant:

Stryker Corporation, Kalamazoo, MI (US);

Inventors:

John J. Janik, Hudsonville, MI (US);

Robert A. Brindley, Delton, MI (US);

Edward Chia-Ning Tang, Ann Arbor, MI (US);

James Bernard Dunlop, Colorado Springs, CO (US);

Leland Joseph Spangler, Manitou Springs, CO (US);

Assignee:

STRYKER CORPORATION, Kalamazoo, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/04 (2006.01); A61N 1/05 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0551 (2013.01); A61N 1/0553 (2013.01); H01L 23/3121 (2013.01); H01L 23/5387 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An electrode array with a flexible array substrate on which plural spaced apart electrodes are disposed. Integrated circuits are disposed in the array substrate. The integrated circuits are mounted to package substrates. The package substrates are more rigid than the array substrate. Internal to each package substrate is at least one electrical conductor. The electrical conductor extends from a bond pad integral with integrated circuit at least partially through the package substrate. The electrical conductor functions as the conductive member that extends between the integrated circuit an electrode with which the integrated circuit is associated.


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