The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 09, 2019
Filed:
May. 25, 2016
Applicant:
B/e Aerospace, Inc., Wellington, FL (US);
Inventors:
Kenneth W. Cowans, Fullerton, CA (US);
William W. Cowans, Fullerton, CA (US);
Glenn Zubillaga, Canon Lake, CA (US);
Assignee:
B/E Aerospace, Inc., Winston Salem, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A23G 9/08 (2006.01); A23G 9/22 (2006.01); F25B 5/04 (2006.01); F25B 40/00 (2006.01); F25B 40/04 (2006.01); F25B 41/00 (2006.01); F25B 41/04 (2006.01); F25B 41/06 (2006.01); F25B 49/02 (2006.01);
U.S. Cl.
CPC ...
A23G 9/086 (2013.01); A23G 9/22 (2013.01); F25B 5/04 (2013.01); F25B 40/00 (2013.01); F25B 40/04 (2013.01); F25B 41/003 (2013.01); F25B 49/02 (2013.01); F25B 41/04 (2013.01); F25B 41/043 (2013.01); F25B 41/06 (2013.01); F25B 2339/041 (2013.01); F25B 2341/0662 (2013.01); F25B 2400/01 (2013.01); F25B 2400/0403 (2013.01); F25B 2400/0405 (2013.01); F25B 2400/0411 (2013.01); F25B 2400/24 (2013.01); F25B 2600/0261 (2013.01); F25B 2600/2501 (2013.01); F25B 2600/2507 (2013.01); F25B 2600/2513 (2013.01); F25B 2600/2521 (2013.01); F25B 2700/1933 (2013.01); F25B 2700/21152 (2013.01); F25B 2700/21171 (2013.01);
Abstract
A temperature control system is disclosed where thermal energy generated by pressurization of a gaseous medium is stored at a selected temperature level so that it is later readily accessible. Temperature control of a two-phase medium is exercised across selectable dynamic ranges and with different resolutions and the control can be exerted by varying the input flow rate of a mixture applied to a thermal load, or by controlling the back pressure of the flow through the thermal load.