The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Dec. 19, 2017
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Maziar Amirkiai, Sunnyvale, CA (US);

Yunpeng Song, Fremont, CA (US);

Peter Henry Mahowald, Sunnyvale, CA (US);

Hongyu Deng, Saratoga, CA (US);

Assignee:

FINISAR CORPORATION, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H05K 1/18 (2006.01); G02B 6/00 (2006.01); G02B 6/42 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); G02B 6/00 (2013.01); G02B 6/4263 (2013.01); G02B 6/4274 (2013.01); H05K 1/181 (2013.01); H05K 1/0243 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10545 (2013.01); Y02P 70/611 (2015.11);
Abstract

This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.


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