The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Jul. 31, 2015
Hewlett-packard Development Company, L.p., Houston, TX (US);
Chien-Hua Chen, Corvallis, OR (US);
Gary G. Lutnesky, Corvallis, OR (US);
Michael W. Cumbie, Corvallis, OR (US);
Eric L. Nikkel, Corvallis, OR (US);
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US);
Abstract
A printed circuit board has a first coefficient of thermal expansion. A compound is molded about the printed circuit board. The compound has a second coefficient of thermal expansion different than the first coefficient of thermal expansion. An interface is between an edge of the printed circuit board and the compound. The interface has a third coefficient of thermal expansion between the first coefficient of thermal expansion and the second coefficient of thermal expansion.