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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10342137 B1

PDFFull Text
Date of Patent:
Jul. 02, 2019

Filed:

Apr. 16, 2018

Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal

Applicant:

Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, Guangdong, CN;

Inventor:

Wenzhen Zhang, Dongguan, CN;

Assignee:

Guangdong Oppo Mobile Telecommunications Corp., Ltd., Dongguan, CN;

Attorney:

Young Basile Hanlon & MacFarlane, P.C.

Primary Examiner:

Roshn K Varghese

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H04M 1/02 (2006.01); G06K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 5/03 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H04M 1/026 (2013.01); H05K 1/0281 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 3/301 (2013.01); H05K 3/305 (2013.01); H05K 3/363 (2013.01); H05K 5/03 (2013.01); G06F 1/1684 (2013.01); G06F 2203/0338 (2013.01); G06K 9/00006 (2013.01); H04M 2250/12 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10325 (2013.01); H05K 2201/10757 (2013.01);
Abstract

A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. The cover plate defines an assembling region. The fingerprint chip is fixed in the assembling region and has a plurality of pads. The intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate. The fingerprint chip is electrically connected to the intermediate board via the pads. The circuit board is electrically connected to the fingerprint chip via the intermediate board. The pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip.

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