The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Jan. 20, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Kiyoyuki Nakagawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H01G 4/005 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01G 2/065 (2013.01); H01G 4/005 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/3442 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10984 (2013.01); H05K 2203/048 (2013.01); H05K 2203/0465 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract

A mounted structure includes an electronic component including external electrodes, a wiring substrate including lands, and joint portions composed of a solder joint material and configured to join the external electrodes and the lands. The external electrodes respectively include coatings that cover a principal surface of a body, which is opposed to the wiring substrate, and coatings that cover end surfaces of the body, which are opposed to each other in the length direction. A distance De between the coatings in the length direction and a distance Dl between the lands in the length direction satisfy a condition of 0.91≤Dl/De≤1.09.


Find Patent Forward Citations

Loading…