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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10342126 B1

PDFFull Text
Date of Patent:
Jul. 02, 2019

Filed:

Aug. 10, 2017

Electronic device having a liquid crystal polymer solder mask and related devices

Applicant:

Harris Corporation, Melbourne, FL (US);

Inventors:

Louis Joseph Rendek, Jr., Melbourne, FL (US);

Travis L. Kerby, Malabar, FL (US);

Casey Philip Rodriguez, Indialantic, FL (US);

Assignee:

HARRIS CORPORATION, Melbourne, FL (US);

Attorney:

Allen, Dyer, Doppelt + Gilchrist, P.A.

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/03 (2013.01); H01L 21/4867 (2013.01); H01L 23/49894 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 3/281 (2013.01); H05K 3/3452 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13599 (2013.01); H01L 2224/16111 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H05K 1/032 (2013.01); H05K 1/0313 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/063 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49117 (2015.01); Y10T 29/49124 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49155 (2015.01);
Abstract

A method of making an electronic device includes forming a circuit layer on a liquid crystal polymer (LCP) substrate and having at least one solder pad. The method also includes forming an LCP solder mask having at least one aperture therein alignable with the at least one solder pad. The method further includes aligning and laminating the LCP solder mask and the LCP substrate together, then positioning solder paste in the at least one aperture. At least one circuit component may then be attached to the at least one solder pad using the solder paste.

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