The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Jul. 20, 2018
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Bruce J. Chamberlin, Vestal, NY (US);
Scott B. King, Rochester, MN (US);
Joseph Kuczynski, North Port, FL (US);
David J. Russell, Owego, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0293 (2013.01); H05K 1/0201 (2013.01); H05K 1/11 (2013.01); H05K 1/181 (2013.01); H05K 1/16 (2013.01); H05K 1/18 (2013.01); H05K 1/182 (2013.01); H05K 1/183 (2013.01); H05K 1/186 (2013.01); H05K 2201/0308 (2013.01);
Abstract
An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.