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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10342116 B1

PDFFull Text
Date of Patent:
Jul. 02, 2019

Filed:

Mar. 09, 2018

High-frequency module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihito Otsubo, Kyoto, JP;

Yoshihisa Masuda, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Binh B Tran

Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/28 (2006.01); H01L 25/04 (2014.01); H05K 9/00 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H05K 3/28 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H01L 23/28 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 25/04 (2013.01); H05K 1/0216 (2013.01); H05K 1/0224 (2013.01); H05K 9/0015 (2013.01); H01L 23/3121 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19105 (2013.01); H05K 3/284 (2013.01); H05K 2201/0715 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A high-frequency module includes a wiring board; a plurality of components mounted on an upper surface of the wiring board; a sealing resin layer that is stacked on the upper surface of the wiring board and that has a step; a groove that is formed in the sealing resin layer to intersect with the step when the wiring board is viewed in plan view, and that extends between predetermined components; and a shield wall disposed in the groove and formed with a conductor. The groove includes a first portion at an upper surface side of the wiring board and a second portion at an upper surface side of the sealing resin layer, the second portion being continuous from the first portion. An area of the second portion is larger than an area of the second portion.

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