The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Apr. 09, 2018
Applicant:

Brillnics Japan Inc., Shinagawa-ku, Tokyo, JP;

Inventors:

Toshinori Otaka, Tokyo, JP;

Shunsuke Okura, Tokyo, JP;

Junichi Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H04N 5/378 (2011.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/379 (2018.08); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H04N 5/378 (2013.01);
Abstract

A solid-state imaging device comprised of a first substrate on which a pixel part is formed and a second substrate on which a column readout circuit is formed along a column level connection part, a row driver is formed along a row level connection part, and a pitch conversion-use interconnect region including a slanted interconnect for pitch conversion among interconnects is formed, the pitch conversion-use interconnect region is formed at least between the end part of the column readout circuit having a third pitch shorter than the pixel part and the end part of the column level connection part and/or between the end part of the row driver having a fourth pitch shorter than the pixel part and the end part of the row level connection part.


Find Patent Forward Citations

Loading…