The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

May. 17, 2017
Applicant:

Centre for Development of Telematics, New Delhi, IN;

Inventors:

Theepak Shoundrabalan, Bengaluru, IN;

Vijaya Suresh Namburi, Bengaluru, IN;

Selvapriya Radhakrishnan, Bengaluru, IN;

Devadas Bhaskaran, Bengaluru, IN;

Soundarakumar Masilamani, Bengaluru, IN;

Vipin Tyagi, New Delhi, IN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/08 (2006.01); H03F 3/189 (2006.01); H03F 3/20 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H03F 3/24 (2006.01);
U.S. Cl.
CPC ...
H03F 1/08 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H03F 3/189 (2013.01); H03F 3/20 (2013.01); H03F 3/24 (2013.01); H01L 2223/6644 (2013.01); H03F 2200/114 (2013.01); H03F 2200/451 (2013.01);
Abstract

Aspects of the present disclosure generally relate to a RF high power amplifier designed for resonance mitigation. A method for resonance mitigation in RF high power amplifier enclosure and an enclosure for RF high power amplifier designed to mitigate resonance is provided. In an aspect, the enclosure can be configured with a metallic post or a grounded metallic post positioned at a suitable location with RF high power amplifier circuit to dampen and shift out resonance. In an aspect, the metallic post can be placed between printed circuit board (PCB) substrate and enclosure lid. Proposed metallic post solution eliminates the need of RF absorber in the design.


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