The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Oct. 05, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Hiroki Sakamoto, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 7/16 (2006.01); H05K 1/18 (2006.01); H01G 4/002 (2006.01); H05K 3/46 (2006.01); H01G 4/258 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H01G 2/06 (2006.01); H05K 1/02 (2006.01); H01G 4/40 (2006.01); H05K 1/11 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H02H 7/16 (2013.01); H01G 2/06 (2013.01); H01G 4/002 (2013.01); H01G 4/258 (2013.01); H01G 4/40 (2013.01); H05K 1/02 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 3/341 (2013.01); H05K 3/4053 (2013.01); H05K 3/4611 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10181 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10636 (2013.01);
Abstract

An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.


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