The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10340672 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 02, 2019

Filed:

Aug. 01, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventor:

Yoshitomo Kawanishi, Nagoya, JP;

Assignee:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H02G 1/14 (2006.01); H01B 1/02 (2006.01); H01R 4/22 (2006.01); H02G 15/04 (2006.01);
U.S. Cl.
CPC ...
H02G 1/14 (2013.01); H01B 1/026 (2013.01); H01R 4/22 (2013.01); H02G 15/043 (2013.01);
Abstract

A conducting wire end portion joining method is a method for conductively joining together end portions of conducting wires each covered with an insulation coating. The conducting wire end portion joining method includes: adjoining end portions of two winding wires, and bringing the end portions of the conducting wires of the two winding wires into contact with a conductive coating material stored in an insulating cap having a property of shrinking when heated; and shrinking the insulating cap by heating to fix the shrunken insulating cap around the insulation coatings of the end portions of the two winding wires, and joining together the end portions of the two winding wires by conductively connecting the conducting wires of the two winding wires via the hardened conductive coating material.


Find Patent Forward Citations

Kawanishi, Yoshitomo. (2019). Conducting wire end portion joining method, and conducting wire end portion joining structure (U.S. Patent No. 10340672). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10340672

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