The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Dec. 07, 2017
Applicant:
Toyoda Gosei Co., Ltd., Kiyosu-shi, Aichi-ken, JP;
Inventor:
Hirotaka Fukui, Kiyosu, JP;
Assignee:
TOYODA GOSEI CO., LTD., Aichi-pref., JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/57 (2011.01); B60Q 3/00 (2017.01); H01R 12/72 (2011.01); F21V 23/06 (2006.01); F21V 19/00 (2006.01); F21V 23/04 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); B60Q 3/00 (2013.01); H01R 12/722 (2013.01); F21V 19/00 (2013.01); F21V 23/04 (2013.01); F21V 23/06 (2013.01); H01R 2107/00 (2013.01);
Abstract
An electronic device includes: a substrate; a housing which covers the substrate; a conductive pin mounted on one edge portion of the substrate. The conductive pin projects from the substrate along a plane of the substrate, the conductive pin includes a projection portion and a soldered portion which is soldered to the substrate, and the soldered portion includes a conducting portion which is electrically conduction with a circuit wiring of the substrate.