The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

May. 17, 2018
Applicant:

Commissariat À L'éńergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Fabrice Nemouchi, Moirans, FR;

Yves Morand, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/778 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/16 (2006.01); H01L 29/24 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66477 (2013.01); H01L 21/0228 (2013.01); H01L 21/3212 (2013.01); H01L 29/0847 (2013.01); H01L 29/41783 (2013.01); H01L 29/66045 (2013.01); H01L 29/66431 (2013.01); H01L 29/66545 (2013.01); H01L 29/66969 (2013.01); H01L 29/778 (2013.01); H01L 29/7789 (2013.01); H01L 29/78 (2013.01); H01L 29/785 (2013.01); H01L 29/1606 (2013.01); H01L 29/24 (2013.01);
Abstract

A MOS transistor manufacturing method, including: forming a first conductive or semiconductor layer; forming a sacrificial gate on the first layer and a second layer made of an insulating material laterally surrounding the sacrificial gate; forming, on either side of the sacrificial gate, source and drain electric connection elements crossing the second layer and contacting the first layer; removing the sacrificial gate and the portion of the first layer located vertically in line with the sacrificial gate; depositing a third layer made of a two-dimensional semiconductor material; depositing a fourth layer made of an insulating material on the third layer; and forming a conductive gate in the opening, on the fourth layer.


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