The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Jul. 30, 2015
Applicants:

David J. Meyer, Fairfax, VA (US);

Brian P. Downey, Alexandria, VA (US);

Douglas S. Katzer, Alexandria, VA (US);

Inventors:

David J. Meyer, Fairfax, VA (US);

Brian P. Downey, Alexandria, VA (US);

Douglas S. Katzer, Alexandria, VA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/45 (2006.01); H01L 21/02 (2006.01); H01L 21/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/45 (2013.01); H01L 21/0254 (2013.01); H01L 21/02378 (2013.01); H01L 21/02458 (2013.01); H01L 21/02491 (2013.01); H01L 21/02505 (2013.01); H01L 21/02529 (2013.01); H01L 21/0485 (2013.01); H01L 21/0495 (2013.01); H01L 29/452 (2013.01);
Abstract

A method for integrating epitaxial, metallic transition metal nitride (TMN) layers within a compound semiconductor device structure. The TMN layers have a similar crystal structure to relevant semiconductors of interest such as silicon carbide (SiC) and the Group III-Nitrides (III-Ns) such as gallium nitride (GaN), aluminum nitride (AlN), indium nitride (InN), and their various alloys. Additionally, the TMN layers have excellent thermal stability and can be deposited in situ with other semiconductor materials, allowing the TMN layers to be buried within the semiconductor device structure to create semiconductor/metal/semiconductor heterostructures and superlattices.


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