The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

May. 23, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Albert Birner, Regensburg, DE;

Helmut Brech, Lappersdorf, DE;

Matthias Zigldrum, Regensburg, DE;

Michaela Braun, Regensburg, DE;

Christian Eckl, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/40 (2006.01); H03F 1/02 (2006.01); H03F 3/193 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 29/063 (2013.01); H01L 21/26513 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/5283 (2013.01); H01L 29/1095 (2013.01); H01L 29/402 (2013.01); H01L 29/66681 (2013.01); H01L 29/7816 (2013.01); H01L 29/7823 (2013.01); H03F 1/0288 (2013.01); H03F 3/193 (2013.01); H03F 2200/451 (2013.01);
Abstract

In an embodiment, a semiconductor device includes a semiconductor substrate having a bulk resistivity ρ≥100 Ohm.cm, a front surface and a rear surface. An LDMOS transistor is arranged in the semiconductor substrate. A RESURF structure including a doped buried layer is arranged in the semiconductor substrate. The LDMOS transistor includes a body contact region doped with a first conductivity type, and a source region disposed in the body contact region and doped with a second conductivity type opposite the first conductivity type. The source region includes a first well and a second well of the same second conductivity type. The first well is more highly doped than the second well. The first well extends from inside the body contact region to outside of a lateral extent of the body contact region in a direction towards a source side of a gate of the LDMOS transistor.


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