The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Jul. 18, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Miyo Miyashita, Tokyo, JP;

Kazuya Yamamoto, Tokyo, JP;

Hiroaki Maehara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/48 (2006.01); H01L 23/492 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/481 (2013.01); H01L 23/4924 (2013.01); H01L 23/66 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/16195 (2013.01);
Abstract

A package includes a conductor base plate having a element fixed to an upper surface thereof, a side wall provided on the conductor base plate to surround the element, the side wall having a conductor portion electrically connected to the conductor base plate, a dielectric cap disposed on the side wall, a front-side metal film provided on an outer surface of the dielectric cap, a first back-side metal film provided on an inner surface of the dielectric cap such that a center of the first back-side metal film approximately coincides with a center of a surface of the dielectric cap which faces the conductor base plate, and a plurality of vias passing through the dielectric cap to achieve electrical connection between the front-side metal film and the first back-side metal film and between the front-side metal film and the conductor portion oldie side wall.


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