The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Jul. 01, 2016
Mitsui Chemicals Tohcello, Inc., Chiyoda-ku, Tokyo, JP;
Jun Kamada, Narashino, JP;
Noboru Kawasaki, Sakura, JP;
Shinichi Usugi, Chiba, JP;
Makoto Sukegawa, Tokyo, JP;
Jin Kinoshita, Nagoya, JP;
Kouji Igarashi, Tokai, JP;
Akimitsu Morimoto, Nagoya, JP;
MITSUI CHEMICALS TOHCELLO, INC., Chiyoda-Ku, JP;
Abstract
This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G'bmin of the storage elastic modulus G′b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G′b250 at 250° C. of 0.005 MPa or above, and a temperature at which G′bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G′cmin of the storage elastic modulus G′c in the range of 25° C. to less than 250° C. of 0.03 MPa.