The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Sep. 05, 2017
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventors:

Shing-Yih Shih, New Taipei, TW;

Jen-Jui Huang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3088 (2013.01); H01L 21/3086 (2013.01);
Abstract

A method of forming dense hole patterns of semiconductor devices includes: forming a plurality of first pillars on at least one lower hard mask layer disposed on a substrate; forming a spacer layer on the lower hard mask layer to form a plurality of second pillars respectively covering the first pillars, wherein a plurality of first holes are formed among the second pillars; etching the spacer layer to expose first portions of the lower hard mask layer via the first holes and expose top surfaces of the first pillars; removing the first pillars to form a plurality of second holes in the spacer layer to expose second portions of the lower hard mask layer; etching the first portions and the second portions of the lower hard mask layer at least until portions of the substrate are exposed; and removing remaining portions of the spacer layer.


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