The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Jun. 14, 2017
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Hiroyuki Demizu, Nagaokakyo, JP;

Kenichi Oshiumi, Nagaokakyo, JP;

Tomohiro Suzuki, Nagaokakyo, JP;

Shinya Yoshida, Nagaokakyo, JP;

Koji Fujimoto, Nagaokakyo, JP;

Tadahisa Sano, Nagaokakyo, JP;

Tsuyoshi Yamamoto, Nagaokakyo, JP;

Yoshinori Ueda, Nagaokakyo, JP;

Shinji Otani, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/15 (2006.01); H01G 9/08 (2006.01); H01G 9/048 (2006.01); H01G 9/045 (2006.01); H01G 9/07 (2006.01); H01G 9/008 (2006.01); H01G 9/04 (2006.01);
U.S. Cl.
CPC ...
H01G 9/048 (2013.01); H01G 9/008 (2013.01); H01G 9/045 (2013.01); H01G 9/07 (2013.01); H01G 9/08 (2013.01); H01G 9/15 (2013.01); H01G 2009/0408 (2013.01);
Abstract

A solid electrolytic capacitor that includes a capacitor element including an anode portion having a metal layer, a dielectric layer, and a cathode portion having a solid electrolyte layer and a current collector layer; a leading conductor layer; an insulating resin body covering the capacitor element and the leading conductor layer, the insulating resin body having a first end surface and a second end surface opposite to each other; a first external electrode; and a second external electrode. The first external electrode has at least one plating layer on the first end surface, and is connected to the leading conductor layer at the first end surface. The second external electrode has at least one plating layer on the second end surface, and is connected to the metal layer at the second end surface.


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