The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Apr. 26, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yasuharu Kinoshita, Fukui, JP;

Shoji Hoshitoku, Fukui, JP;

Hironori Tsubota, Fukui, JP;

Yasuhiro Kashima, Fukui, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 1/142 (2006.01); H01C 17/28 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01C 1/142 (2013.01); H01C 17/28 (2013.01); H01L 28/20 (2013.01);
Abstract

A chip resistor includes a resistive element, first and second electrodes disposed on a lower surface the resistive element, a protective film disposed on the lower surface of the resistive element and between the first and second electrodes. The resistive element has first and second recesses therein. The first recess extends from the lower surface along a first edge surface and does not reach an upper surface of the resistive element. The second recess extends from the lower surface along a second edge surface and does not reach the upper surface of the resistive element. The first and second electrodes are disposed between the first and second recesses. The protective film is disposed between the first and second electrodes. A first plating layer disposed on the first electrode and an inner surface of the first recess. A second plating layer is disposed on the second electrode and an inner surface of the second recess. This chip resistor avoids mounting failures.


Find Patent Forward Citations

Loading…