The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Aug. 31, 2017
Applicant:

Oracle International Corporation, Redwood Shores, CA (US);

Inventors:

Tanushriya Singh, Austin, TX (US);

Akshay Sharma, Austin, TX (US);

Duo Ding, Austin, TX (US);

Chen Dan Dong, Austin, TX (US);

Assignee:

ORACLE INTERNATIONAL CORPORATION, Redwood Shores, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5072 (2013.01); G06F 17/5077 (2013.01);
Abstract

A method for enhancing a chip layout may include obtaining the chip layout including a first layer including first and second tracks, a first route occupying the first track, and an open net including open terminals. The method may further include grouping the open terminals into at least a first subset of open terminals, calculating, based on the first subset, a region of interest (ROI), determining that neither the first track nor the second track within the ROI can be used to connect all the open terminals in the first subset, determining that the first track can be used to connect all the open terminals in the first subset after moving the first route from the first track to the second track, moving, the first route from the first track to the second track, and attempting to connect all the open terminals in the first subset using the first track.


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