The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10338888 B1

Expired

Date of Patent:

Jul. 02, 2019

Filed:

Aug. 08, 2017

Electronic component footprint setup system in collaboration with a circuit layout system and a method thereof

Applicant:

Footprintku Inc., Kaohsiung, TW;

Inventors:

Cheng-Ta Lu, Kaohsiung, TW;

Yu-Cheng Hu, Kaohsiung, TW;

Guan-Yu Shih, Kaohsiung, TW;

Kun-You Lin, Kaohsiung, TW;

Mong-Fong Horng, Kaohsiung, TW;

Assignee:

Footprintku Inc., Kaohsiung, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Paul Dinh

Int. Cl.

CPC ...

G06F 17/50 (2006.01); G06F 7/32 (2006.01); G06F 16/23 (2019.01);

U.S. Cl.

CPC ...

G06F 7/32 (2013.01); G06F 16/23 (2019.01); G06F 17/509 (2013.01); G06F 17/5072 (2013.01); G06F 2217/04 (2013.01); G06F 2217/74 (2013.01);

Abstract

An electronic component footprint setup system in collaboration with a circuit layout system and a method thereof are provided in the present disclosure. The electronic component footprint setup system in collaboration with a circuit layout system provides a user operating the circuit layout system with an interface on which parameters of an electronic component footprint to be created are configured; the parameters of the electronic component footprint are transformed for conforming to electronic component footprint specifications used in the circuit layout system; characteristic values of the electronic component footprint are calculated according to electronic component footprint specifications and electronic component footprint setup regulations; the electronic component footprint is created in the circuit layout system according to the characteristic values.

Find Patent Forward Citations

Lu, Cheng-Ta. (2019). Electronic component footprint setup system in collaboration with a circuit layout system and a method thereof (U.S. Patent No. 10338888). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10338888

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile