The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Nov. 27, 2014
Conductive structure body precursor, conductive structure body and method for manufacturing the same
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jin Hyong Lim, Daejeon, KR;
Yong Chan Kim, Daejeon, KR;
Junghwan Yoon, Daejeon, KR;
Jung Il Yoon, Daejeon, KR;
Ki-Hwan Kim, Daejeon, KR;
Ilha Lee, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); G06F 3/041 (2006.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); G06F 1/16 (2013.01); H01L 31/022466 (2013.01); H01L 31/022475 (2013.01); H01L 31/022483 (2013.01); H05K 1/0296 (2013.01); H05K 1/09 (2013.01); H05K 3/0017 (2013.01); H05K 3/022 (2013.01); G06F 2203/04103 (2013.01); H05K 1/0274 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0326 (2013.01); H05K 2203/0315 (2013.01); H05K 2203/105 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1545 (2013.01);
Abstract
The present application provides a conductive structure body precursor, a conductive structure body and a method for manufacturing the same.