The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Dec. 24, 2014
Applicant:

Zeon Corporation, Tokyo, JP;

Inventor:

Hironari Sudeji, Tokyo, JP;

Assignee:

ZEON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2019.01); G02B 5/30 (2006.01); B29C 48/08 (2019.01); B29C 48/88 (2019.01); B29C 55/08 (2006.01); B32B 27/08 (2006.01); B29D 11/00 (2006.01); B05D 1/28 (2006.01); B05D 3/14 (2006.01); B29C 55/02 (2006.01); G02F 1/1335 (2006.01); G02F 1/13363 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); C09D 175/06 (2006.01); C08G 18/44 (2006.01); B29K 675/00 (2006.01); B29L 7/00 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
G02B 5/3083 (2013.01); B05D 1/28 (2013.01); B05D 3/144 (2013.01); B29C 48/08 (2019.02); B29C 48/9135 (2019.02); B29C 55/023 (2013.01); B29C 55/08 (2013.01); B29D 11/0073 (2013.01); B32B 27/08 (2013.01); B32B 27/306 (2013.01); B32B 27/325 (2013.01); C08G 18/44 (2013.01); C09D 175/06 (2013.01); G02B 5/305 (2013.01); G02B 5/3033 (2013.01); G02F 1/13363 (2013.01); G02F 1/133528 (2013.01); B05D 2201/02 (2013.01); B05D 2503/00 (2013.01); B29K 2675/00 (2013.01); B29L 2007/008 (2013.01); B29L 2009/005 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/42 (2013.01); B32B 2307/51 (2013.01); B32B 2307/514 (2013.01); B32B 2457/202 (2013.01); G02F 2001/133638 (2013.01); G02F 2202/28 (2013.01); G02F 2413/01 (2013.01); G02F 2413/05 (2013.01);
Abstract

A multilayer film including: an A layer composed of a thermoplastic resin; and a B layer disposed on at least one of the surfaces of the A layer, the B layer being composed of a material Y that contains as a main component a polymer having a glass transition temperature of −50 to 40° C., and a thickness Ta of the A layer, a thickness Tb of the B layer, a planar orientation coefficient P of the A layer, a loss modulus Ea″ of the A layer, a loss modulus Eb″ of the B layer, a storage modulus Ea' of the A layer, and a storage modulus Eb′ of the B layer satisfying following formulae (1) to (4):2.5×10<1.0×10  (1)>1.0×10  (2)″+0.01 GPa  (3)′−1 GPa.  (4)


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