The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Mar. 07, 2017
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Noboru Tokuyasu, Hitachinaka, JP;

Shinobu Tashiro, Hitachinaka, JP;

Keiji Hanzawa, Hitachinaka, JP;

Tsutomu Kono, Tokyo, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/684 (2006.01); G01F 1/692 (2006.01); G01F 1/696 (2006.01); G01F 15/14 (2006.01); F02D 41/18 (2006.01); G01F 1/698 (2006.01); G01F 1/699 (2006.01); G01F 5/00 (2006.01); G01F 15/00 (2006.01); G01F 15/02 (2006.01); G01F 15/04 (2006.01); G01F 15/18 (2006.01); F02M 35/10 (2006.01);
U.S. Cl.
CPC ...
G01F 1/696 (2013.01); F02D 41/18 (2013.01); F02M 35/1038 (2013.01); F02M 35/10386 (2013.01); G01F 1/684 (2013.01); G01F 1/6842 (2013.01); G01F 1/6845 (2013.01); G01F 1/698 (2013.01); G01F 1/699 (2013.01); G01F 1/6965 (2013.01); G01F 5/00 (2013.01); G01F 15/006 (2013.01); G01F 15/02 (2013.01); G01F 15/04 (2013.01); G01F 15/043 (2013.01); G01F 15/14 (2013.01); G01F 15/185 (2013.01);
Abstract

To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element. A thermal flow meterof the present invention includes an air flow sensing portionthat detects a flow rate by performing heat transfer with a measurement target gas passing through the main passageusing a heat transfer surface, a temperature detection elementthat detects a temperature of the measurement target gas, a circuit packageobtained by connecting a processing unitthat processes signals of the air flow sensing portionand the temperature detection elementto a lead and sealing the processing unitusing a first molding resin through a first molding process, and a housingwhere the circuit packageis fixed using a second molding resin through a second molding process, wherein, in the circuit package, a thickness of a temperature detecting portionfor sealing the temperature detection elementis thinner than that of a package body portionfor sealing the processing unit


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