The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Mar. 30, 2016
Applicant:
Koito Manufacturing Co., Ltd., Tokyo, JP;
Inventors:
Atsushi Ozawa, Shizuoka, JP;
Takuya Serita, Shizuoka, JP;
Yoshimasa Murata, Shizuoka, JP;
Ryota Naito, Shizuoka, JP;
Takahiro Kumeta, Shizuoka, JP;
Assignee:
KOITO MANUFACTURING CO., LTD., Minato-ku, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 43/19 (2018.01); F21V 29/74 (2015.01); F21S 43/14 (2018.01); F21S 45/47 (2018.01); F21Y 115/10 (2016.01); F21S 41/19 (2018.01); F21S 41/141 (2018.01); F21S 45/10 (2018.01);
U.S. Cl.
CPC ...
F21V 29/74 (2015.01); F21S 43/14 (2018.01); F21S 43/195 (2018.01); F21S 45/47 (2018.01); F21S 41/141 (2018.01); F21S 41/192 (2018.01); F21S 45/10 (2018.01); F21Y 2115/10 (2016.08);
Abstract
In one embodiment of a light source unit, the heat-dissipation plate is provided with a first heat-dissipation portion in contact with the substrate, the resin molding part is provided with a plurality of heat-dissipation fins and an engaging portion to be engaged with a predetermined member, and the socket housing is formed by an integral molding of the heat-dissipation plate and the resin molding part.