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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10336913 B1

PDFFull Text
Date of Patent:
Jul. 02, 2019

Filed:

Aug. 27, 2014

Curable silicone composition, cured product thereof, and optical semiconductor device

Applicant:

Dow Corning Toray, Co., Ltd., Tokyo, JP;

Inventors:

Kazuhiro Nishijima, Ichihara, JP;

Tomohiro Iimura, Ichihara, JP;

Michitaka Suto, Ichihara, JP;

Takashi Sagawa, Ichihara, JP;

Haruhiko Furukawa, Ichihara, JP;

Assignee:

DOW CORNING TORAY CO., LTD., Tokyo, JP;

Attorney:

Howard & Howard Attorneys PLLC

Primary Examiner:

Kuo Liang Peng

Int. Cl.
CPC ...
C09D 183/04 (2006.01); H01L 33/56 (2010.01); C08L 83/04 (2006.01); C09D 5/22 (2006.01); H01L 33/50 (2010.01); C09D 7/61 (2018.01); C08K 5/56 (2006.01); C08L 83/00 (2006.01); C08L 83/14 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 5/54 (2006.01); C08G 77/58 (2006.01);
U.S. Cl.
CPC ...
C09D 183/04 (2013.01); C08K 5/56 (2013.01); C08L 83/00 (2013.01); C08L 83/04 (2013.01); C08L 83/14 (2013.01); C09D 5/22 (2013.01); C09D 7/61 (2018.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08G 77/58 (2013.01); C08K 5/54 (2013.01); C08K 2201/008 (2013.01); C08L 2205/025 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01);
Abstract

The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.

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