The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
Jun. 26, 2017
Applicant:
Agc Inc., Chiyoda-ku, JP;
Inventors:
Shingo Endo, Tokyo, JP;
Makoto Fujii, Tokyo, JP;
Satoshi Kanasugi, Tokyo, JP;
Shosuke Kimura, Tokyo, JP;
Assignee:
AGC Inc., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C03B 23/00 (2006.01); C03B 23/023 (2006.01); C03B 29/08 (2006.01); C03C 3/087 (2006.01); C03C 3/085 (2006.01); C03C 3/097 (2006.01); C03C 15/00 (2006.01); C03C 17/30 (2006.01); C03C 21/00 (2006.01);
U.S. Cl.
CPC ...
C03B 23/0086 (2013.01); C03B 23/0013 (2013.01); C03B 23/0026 (2013.01); C03B 23/0235 (2013.01); C03B 29/08 (2013.01); C03C 3/085 (2013.01); C03C 3/087 (2013.01); C03C 3/097 (2013.01); C03C 15/00 (2013.01); C03C 17/30 (2013.01); C03C 21/002 (2013.01); C03C 2217/734 (2013.01); Y02P 40/57 (2015.11);
Abstract
A method for manufacturing a formed glass includes using a heating apparatus. The heating apparatus includes a heating element and a heat reservoir having a transmittance of 50% or more in a wavelength of 0.5 μm to 2.5 μm. The heat reservoir is arranged between the heating element and a glass substrate as an object to be heated. The glass substrate is heated with the heating element, and the glass substrate is formed into a desired shape.