The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Mar. 25, 2015
Applicant:

I-squared Gmbh, Baar, CH;

Inventors:

Jan-Michael Stepper, Bottighofen, CH;

Tsuneo Hagiwara, Tokyo, JP;

Assignee:

ISQUARED GmbH, Lengwil-Oberhofen, CH;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B33Y 40/00 (2015.01); C08F 220/58 (2006.01); C08L 33/14 (2006.01); C08F 2/48 (2006.01); B33Y 70/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/112 (2017.01); B29C 64/40 (2017.01); C08F 220/28 (2006.01); C08F 220/36 (2006.01); B29C 64/124 (2017.01);
U.S. Cl.
CPC ...
B33Y 40/00 (2014.12); B29C 64/112 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08F 2/48 (2013.01); C08F 220/28 (2013.01); C08F 220/36 (2013.01); C08F 220/58 (2013.01); C08L 33/14 (2013.01); B29C 64/124 (2017.08); C08F 2500/17 (2013.01); C08F 2800/20 (2013.01); C08L 2312/06 (2013.01);
Abstract

A photocurable resin composition for support regions for use in photochemical fabrication by an inkjet method, which has low viscosity and outstanding photocurability, and where the support regions, formed by the photocuring, have good supporting performance and, following the end of the photochemical fabrication, can readily be removed from the main body by dissolving in water and/or by a weak external force such as a water jet. The photocurable resin composition for support regions for use in photochemical 3D fabrication by the inkjet method contains, based on the total mass of photocurable resin composition, from 2 to 20 mass % of N-hydroxyalkyl (meth) acrylamide, from 2 to 20 mass % of (meth) acryloyl morpholine, from 3 to 30 mass % of (meth) acrylate compound having at least one (meth) acryloyloxy group, from 40 to 90 mass % of polyhydroxy compound containing two or more hydroxyl groups, and from 0.1 to 5 mass % of a photo-radical polymerization initiator.


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