The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2019
Filed:
May. 08, 2014
Method for automatic calibration of a device for generative production of a three-dimensional object
Eos Gmbh Electro Optical Systems, Krailling, DE;
Hans Perret, München, DE;
Jochen Philippi, Grafelfing, DE;
EOS GMBH ELECTRO OPTICAL SYSTEMS, Krailling, DE;
Abstract
A method for automatically calibrating a device for generatively producing a three-dimensional object () comprises the following steps: irradiating an applied layer of a material () or a target by means of a first scanner () in order to produce a first test pattern () in the material () or the target; irradiating the applied layer of the material () or the target by means of a second scanner () in order to produce a second test pattern () in the material () or the target; detecting the first and second test patterns () by means of a camera () and assigning the first and second test patterns () to the first and second scanners (), respectively; comparing the first and/or the second test pattern () with a reference pattern and/or comparing the first and second test patterns () with one another; determining a first deviation of the first test pattern () from the reference pattern and/or a second deviation of the second test pattern () from the reference pattern and/or a relative deviation between the first test pattern () and the second test pattern (); and calibrating the first and/or the second scanner () in such a way that the first and/or the second deviation from the reference pattern and/or the relative deviation between the first test pattern () and the second test pattern () falls below a setpoint value.