The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Apr. 18, 2016
Applicant:

Toshiba Medical Systems Corporation, Otawara-shi, JP;

Inventors:

Hiroyuki Shikata, Nasushiobara, JP;

Takeshi Miyagi, Fujisawa, JP;

Kengo Okada, Kawasaki, JP;

Fumiyasu Sakaguchi, Otawara, JP;

Satoru Tezuka, Nasushiobara, JP;

Takashi Takeuchi, Otawara, JP;

Yasuhiro Ona, Nasushiobara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); G01N 29/02 (2006.01); G01N 29/24 (2006.01); G01N 29/32 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0622 (2013.01); G01N 29/245 (2013.01); G01N 29/32 (2013.01); G01N 2291/0289 (2013.01); G01N 2291/044 (2013.01); G01N 2291/106 (2013.01);
Abstract

According to one embodiment, an ultrasonic probe includes piezoelectric elements, a flexible printed circuit, and one of an air gap layer and a resin layer. The piezoelectric elements transmit and receive ultrasonic waves. The flexible printed circuit located on a rear surface side of the piezoelectric elements and electrically connected to the piezoelectric elements. The air gap layer locates on a rear surface side of the flexible printed circuit and has air gaps. The resin layer is obtained by filling the air gap layer with a resin and locates on the rear surface side of the flexible printed circuit.


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