The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Dec. 22, 2016
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Herman Oprins, Herent, BE;

Vladimir Cherman, Heverlee, BE;

Eric Beyne, Heverlee, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/06 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); H01L 23/4735 (2013.01); H05K 5/06 (2013.01);
Abstract

A liquid cooling system for cooling an electronic device comprising a chip or a chip package comprising a chip is described. The liquid cooling system comprises an inlet plenum comprising a coolant feeding channel oriented substantially parallel with the plane of a main surface to be cooled of the chip and a plurality of inlet cooling channels fluidically connected to the coolant feeding channel and arranged vertically for impinging a liquid coolant directly on said main surface of the chip. The vertically oriented inlet cooling channels are substantially parallel to vertically oriented outlet cooling channels and are separated by a thermally isolating material. The liquid cooling system further comprises at least one cavity wherein a plurality of inlet and outlet cooling channels end. The cavity is arranged for allowing interaction between the liquid coolant and the main surface of the chip and thus comprises a heat transfer region.


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