The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Aug. 30, 2016
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Tou Chin, Mie, JP;

Arinobu Nakamura, Mie, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H02G 3/16 (2006.01); H05K 1/18 (2006.01); H05K 7/14 (2006.01); H02G 3/03 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H02G 3/03 (2013.01); H02G 3/16 (2013.01); H05K 1/0203 (2013.01); H05K 3/3452 (2013.01); H05K 3/3494 (2013.01); H05K 7/1432 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10409 (2013.01);
Abstract

A circuit assembly includes a circuit board provided with a connection opening, a plurality of busbars provided on a back surface of the circuit board, an electronic component provided with connection terminals that are soldered to the corresponding busbar exposed through the connection opening, and a solder restricting layer that is provided between the circuit board and the plurality of busbars and includes a pattern surrounding a soldering region of the busbar to which the connection terminals are soldered.


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