The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Apr. 19, 2018
Applicant:

Realtek Semiconductor Corp., Hsin-Chu, TW;

Inventors:

Chao-Min Lai, Hsinchu, TW;

Shou-Te Yen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 23/52 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0243 (2013.01); H05K 1/0248 (2013.01); H05K 1/113 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 1/114 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10712 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.


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