The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Nov. 01, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

William L. Brodsky, Binghamton, NY (US);

James A. Busby, New Paltz, NY (US);

Phillip Duane Isaacs, Rochester, MN (US);

David C. Long, Wappingers Falls, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 1/09 (2006.01); H05K 7/02 (2006.01); H05K 3/30 (2006.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); H05K 1/0298 (2013.01); H05K 1/034 (2013.01); H05K 1/09 (2013.01); H05K 1/183 (2013.01); H05K 3/12 (2013.01); H05K 3/30 (2013.01); H05K 3/301 (2013.01); H05K 3/46 (2013.01); H05K 5/0208 (2013.01); H05K 7/023 (2013.01); H05K 2201/015 (2013.01); H05K 2201/05 (2013.01); H05K 2201/055 (2013.01); H05K 2201/056 (2013.01);
Abstract

Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width W≤200 μm, as well as a line-to-line spacing width W≤200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.


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