The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

Aug. 25, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Kaustubh Ravindra Nagarkar, Clifton Park, NY (US);

Yongjae Lee, Latham, NY (US);

Christopher James Kapusta, Delanson, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/64 (2006.01); H03H 9/72 (2006.01); H03H 9/54 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H03H 9/54 (2013.01); H03H 3/02 (2013.01); H03H 9/0547 (2013.01); H03H 9/1042 (2013.01); H03H 9/1071 (2013.01); H03H 9/1085 (2013.01); H03H 9/64 (2013.01); H01L 2224/18 (2013.01);
Abstract

A filter package and method of manufacturing thereof is disclosed. The filter device package includes a first dielectric layer having an acoustic wave filter device attached thereto, the acoustic wave filter device comprising an active area and I/O pads. The filter device package also includes an adhesive positioned between the first dielectric layer and the acoustic wave filter device to secure the layer to the device, vias formed through the first dielectric layer and the adhesive to the I/O pads of the acoustic wave filter device, and metal interconnects formed in the vias and mechanically and electrically coupled to the I/O pads of the acoustic wave filter device to form electrical interconnections thereto, wherein an air cavity is formed in the adhesive between the acoustic wave filter device and the first dielectric layer, in a location adjacent the active area of the acoustic wave filter device.


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